55°C to +175°C Asynchronous SRAM
| Part Number | Density | Org | Package | Vcc | Type | Speed | MaxTemp |
|---|---|---|---|---|---|---|---|
| TTS512M16 | 8Mb | 512Kx8 | D, P, S, L, F, G, CS | 5V | Parallel | 20ns | +200°C |
| TTS512MLV16 | 8Mb | 512Kx8 | D, P, S, L, F, G, CS | 2.7 to 3.3V | Parallel | 20ns | +200°C |
| TTS1MLV6 | 16Mb | 1Mx16 | D, P, S, L, F, G, CS | 2.7 to 3.6V | Parallel | 20ns | +200°C |
| TTS2MLV8 | 16Mb | 2Mx8 | D, P, S, L, F, G, CS | 5V | Parallel | 20ns | +200°C |
-55°C to +175°C Serial EEPROM
| Part Number | Density | Org | Package | Vcc | Type | Speed | MaxTemp |
|---|---|---|---|---|---|---|---|
| TTE24C64 | 64K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | I2C | 400KHz | +175°C |
| TTE25C64 | 64K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | SPI | 10MHz | +175°C |
| TTE24C128 | 128K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | I2C | 400KHz | +175°C |
| TTE25C128 | 128K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | SPI | 10MHz | +175°C |
| TTE24C256 | 256K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | I2C | 400KHz | +175°C |
| TTE25C256 | 256K | - | D, P, S, L, F, G, CS | 2.7 to 5.5V | SPI | 10MHz | +175°C |
-55°C to +200°C Parallel EEPROM
| Part Number | Density | Org | Package | Vcc | Type | Speed | MaxTemp |
|---|---|---|---|---|---|---|---|
| TTE28HT010 | 1Mb | 128Kx8 | D, P, S, L, F, G, CS | 5V | Parallel | 200, 250ns | +200°C |
-55°C to +200°C SPI Flash
| Part Number | Density | Org | Package | Vcc | Type | Speed | MaxTemp |
|---|---|---|---|---|---|---|---|
| TTZ2501 | 1Mb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
| TTZ2564 | 64Mb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
| TTZ25128 | 128Mb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
| TTZ25M256 | 256Mb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
| TTZ25M512 | 512Mb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
| TTZ25M01G | 1Gb | - | D, P, S, L, F, G, CS | 2.7 to 3.3V | SPI | 10MHz | +200°C |
Packages: Ceramic DIP (D), Plastic DIP (P), Plastic Extended SOIC (S), Pin Grid Array (L), Ceramic Flat Pack (F), Leadless Chip Carrier (G), Ceramic SOIC (CS) Custom packages are available on request.
SeSemi Electronics distributes the above range of high temperature semiconductors for TT Semiconductor in the UK, Scandinavia, France and Italy.
Download the full product range here – TT Selector Guide